Mattea Eckstein, M.Sc.

2023

1. Ziegler, P., Linzmaier, J., Haarer, J., Marx, P., Eckstein, M., Roth-Stielow, J.: Wide Bandwidth Current Sensors and the Influence on the Switching Loss Characterization. In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia). pp. 1181–1188 (2023).
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   BibTeX

   @inproceedings{10213817, abstract = {Due to their outstanding properties, wide bandgap semiconductor devices enable better performance and efficiency in power electronic circuits compared to silicon devices. However, characterizing the switching loss of such devices is even more challenging. The limits of measurement equipment, especially for the current measurement, are reached due to the fast rise and fall times. Ideal characterization requires a non-invasive, infinite bandwidth current sensor. This paper presents a galvanically isolated current sensor that combines magnetic field sensors and a printed circuit board integrated Rogowski coil. The insertion inductance of the hybrid current sensor is compared to a commercial coaxial shunt and a low inductance SMD shunt approach. The influence of the different current measurement devices on the switching loss characterization is investigated.}, author = {Ziegler, Philipp and Linzmaier, Jan and Haarer, Jörg and Marx, Philipp and Eckstein, Mattea and Roth-Stielow, Jörg}, booktitle = {2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)}, issn = {2150-6086}, month = {05}, pages = {1181-1188}, title = {Wide Bandwidth Current Sensors and the Influence on the Switching Loss Characterization}, url = {https://ieeexplore.ieee.org/document/10213817}, year = 2023 }

   Link

   https://ieeexplore.ieee.org/document/10213817
2. Ziegler, P., Haarer, J., Marx, P., Eckstein, M., Haspel, A., Roth-Stielow, J.: Evaluation of a Low-Cost Wide Bandwidth Current Shunt for Characterization of Wide Bandgap Semiconductor Devices. In: 2023 25th European Conference on Power Electronics and Applications (EPE’23 ECCE Europe). pp. 1–9 (2023).
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   BibTeX

   @inproceedings{10264595, abstract = {Characterizing the switching losses of wide bandgap semiconductor devices requires wide bandwidth measurement equipment with the smallest possible insertion inductance added to the commutation path by the current sensor. A common current measurement approach is using low-cost off-the-shelf SMD resistors and measure the voltage drop. This SMD shunt approach has a limited bandwidth due to parasitic inductances. In this work, an evaluation of such a low-cost current shunt is performed. The influences and constraints that limit the bandwidth are investigated. The design of a compensation network and the resulting bandwidth improvement are examined. Based on the theoretical discussion, a compact current shunt is designed, that allows a simple integration into the commutation path while adding a low insertion inductance. The measurement results show, that the common measurement approach can reach a bandwidth of several hundred MHz if the design constraints are met and can be further extended by a compensation network.}, author = {Ziegler, Philipp and Haarer, Jörg and Marx, Philipp and Eckstein, Mattea and Haspel, André and Roth-Stielow, Jörg}, booktitle = {2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)}, month = {09}, pages = {1-9}, title = {Evaluation of a Low-Cost Wide Bandwidth Current Shunt for Characterization of Wide Bandgap Semiconductor Devices}, url = {https://ieeexplore.ieee.org/document/10264595}, year = 2023 }

   Link

   https://ieeexplore.ieee.org/document/10264595
3. Haspel, A., Ketchedjian, V., Marx, P., Eckstein, M., Roth-Stielow, J.: Composition of the Countervoltage for Power-Hardware-in-the-Loop Emulators for Three-Phase Machines. In: 2023 25th European Conference on Power Electronics and Applications (EPE’23 ECCE Europe). pp. 1–10 (2023).
   • BibTeX
   • Link

   BibTeX

   @inproceedings{10264532, abstract = {To emulate the reaction of an electrical machine interacting with a device-under-test inverter, a power-hardware-in-the-loop emulator has to provide a suitable countervoltage per phase. For the correct emulation of the dynamic electrical behavior of the machine, especially the current ripple, the countervoltage has to include a steady oscillating component and a stepwise changing component. This paper introduces a novel approach to determine the analytically ideal shape of the countervoltage for the emulation of three-phase machines and provides a simulative validation. As example, a synchronous machine operated with a two-level voltage source inverter is regarded. It is shown that the relation between the machine’s direct and quadrature inductances as well as the coupling between the device-under-test inverter and the emulator have a significant influence on the shape of the countervoltage.}, author = {Haspel, André and Ketchedjian, Vasken and Marx, Philipp and Eckstein, Mattea and Roth-Stielow, Jörg}, booktitle = {2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)}, month = {09}, pages = {1-10}, title = {Composition of the Countervoltage for Power-Hardware-in-the-Loop Emulators for Three-Phase Machines}, url = {https://ieeexplore.ieee.org/document/10264532}, year = 2023 }

   Link

   https://ieeexplore.ieee.org/document/10264532